Waferpedia

Nitto

DR 8500 II Wafer Taper

Dicing & GrindingNitto DR 8500 family
Research Quality: 10% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

NittoDR 8500 II Wafer Taper
No photo available yet

What is it?

The Nitto Denko DR 8500 II is a PLC-based wafer taper.

What do the numbers mean?

Control & software1

PLC based system[1]
Accurate?
Interested in this tool?
Need help with this tool?Embed spec card

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Worked with this tool? Help preserve its knowledge →

Frequently asked questions

What wafer thickness range is applicable for the DR 8500 II?

The DR 8500 II is applicable for wafer thicknesses from 300 to 1000 micrometers.[2]

Not publicly documented

The following facts about the DR 8500 II Wafer Taper are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • Fewer than 3 independently cited specifications for the DR 8500 II Wafer Taper are on record; the remainder await public documentation.

    Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DR 8500 II Wafer Taper are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the DR 8500 II Wafer Taper are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the DR 8500 II Wafer Taper are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the DR 8500 II Wafer Taper are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Nitto Denko DR 8500II & HR 8500II — wotol.comwotol.com
Was this page accurate?

Last updated Oct 5, 2026.

Compare with similar tools

View all →