MyData
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A pick and place machine uses a gantry or robotic arm to transport components from feeder tapes or trays to a printed circuit board located on a precision positioning table.
The machine employs optical vision systems to locate fiducial marks on the board and to inspect component orientation before placement.
In a surface-mount technology line, the pick and place machine is positioned after the solder paste printer and before the reflow soldering oven.
The upstream process applies solder paste to the board pads, and the downstream process melts the solder to permanently attach the components placed by the pick and place machine.
Such machines are employed in electronics manufacturing for applications including consumer electronics, automotive electronics, industrial controls, and telecommunications equipment.
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The following facts about the MY 15 E are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the MY 15 E are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MY 15 E are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the MY 15 E are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the MY 15 E are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the MY 15 E are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Last updated Oct 8, 2026.
The Dek 03 iX Automatic is an automatic paste printer used in surface-mount technology assembly.