Lam Research

TCP9100

Research Quality: 30% complete

The Lam TCP9100 is an etcher used for BCB plasma etching. The Lam TCP9100 is cited in an example sub-micron BCB via profile etched with an oxide hard mask. The Lam TCP9100 example uses 10 mTorr pressure, 1500 W TCP power, 700 W RF power, 18 sccm O2, 2 sccm C2F6, and 40 sccm N2.^[1]^[2]

Fig. — Manufacturer logo, not a photo of this toolWikimedia Commons (see file page for license)

Power

700 W^[1]

Vacuum

10 mTorr^[1]

Gas delivery

18 sccm^[1]

What is it?

The Lam TCP9100 is referenced as an etcher used in plasma etch work on CYCLOTENE 3000 series dry etch resins. The Lam TCP9100 is shown in an example sub-micron BCB via process with stated etch conditions of 10 mTorr pressure, 1500 W TCP power, 700 W RF power, 18 sccm O2, 2 sccm C2F6, and 40 sccm N2.

What can it run?

Process applications and technology nodes documented for this tool.

plasma etching of CYCLOTENE films
sub-micron BCB via profile etch

Why won't it start?

Documented failure modes, common issues, and field considerations.

Barrel etchers are not recommended for this BCB etch process.
O2-only plasma etching is not recommended for this BCB etch process.

What do the numbers mean?

Power & electrical1

Example RF power: 700 W^[1]

Vacuum & pumping1

Example process pressure: 10 mTorr^[1]

Gas & chemistry3

Example O2 flow: 18 sccm^[1]
Example C2F6 flow: 2 sccm^[1]
Example N2 flow: 40 sccm^[1]

Configuration & options4

Tool type: etcher^[1]
Use case: plasma etching of CYCLOTENE films^[1]
Example TCP power: 1500 W^[1]
Example application: sub-micron BCB via profile etch^[1]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Example process pressure10 mTorr^[1]
Example RF power700 W^[1]
Example O2 flow18 sccm^[1]
Example C2F6 flow2 sccm^[1]
Example N2 flow40 sccm^[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the TCP9100 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the TCP9100 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the TCP9100 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the TCP9100 are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the TCP9100 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the TCP9100 are on record.
Answerable by: an OEM parts catalog or a service engineer

Sources & citations

Sources (2)Every fact above is drawn from these public sources

[1]wiki.nanofab.ucsb.edu — wiki.nanofab.ucsb.eduwiki.nanofab.ucsb.edu
[2]https://wiki.nanotech.ucsb.edu/w/images/7/72/BCB-cyclotene-3000-revA.pdf — wiki.nanotech.ucsb.eduwiki.nanotech.ucsb.edu