Lam Research
Concept One 150
What it is
General reference — not yet source-verifiedPECVD systems deposit thin films onto semiconductor wafers by using a plasma to enhance chemical reactions of precursor gases. The plasma allows lower deposition temperatures compared to conventional CVD.
How it works
General reference — not yet source-verifiedIn a PECVD reactor, precursor gases are introduced into a vacuum chamber and a radio-frequency (RF) electric field ignites a plasma. The plasma dissociates the gases into reactive species that form a solid film on the wafer surface.
Where it fits in the process flow
General reference — not yet source-verifiedPECVD systems are used in semiconductor manufacturing to deposit interlayer dielectrics, passivation layers, and other insulating films between metal interconnect layers.
What do the numbers mean?
Wafer handling5
- Robot Single Arm[1]
Control & software2
- Y2K Pentium Computer W/4.433[2]
Configuration & options23
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Applied Materials P 5000 Mark II DLH— Same function class: Deposition, nullCompare in depthsource[3]
- Applied Materials Producer S— Same function class: Deposition, nullCompare in depthsource[5]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the Concept One 150 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Concept One 150 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Concept One 150 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Concept One 150 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Concept One 150 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Concept One 150 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]inventory listing
- [4]inventory listing
- [5]Equipment inventory listing
Last updated Oct 2, 2026.
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The Applied Materials P 5000 Mark II DLH is a plasma-enhanced chemical vapor deposition (PECVD) system for 6-inch wafers.
Applied Materials Producer S is a PECVD (plasma-enhanced chemical vapor deposition) system for 8-inch wafers.
The Applied Materials 0010-13622 is an RF match unit intended for PVD (Physical Vapor Deposition) described as a High Efficiency HE RF Match-Bias.