Kulicke & Soffa

Rapid Pro Automatic

Packaging & Bonding Kulicke & Soffa Rapid Pro Automatic family

Research Quality: 50% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Rapid Pro Automatic is a Kulicke & Soffa automatic wire bonder. The Rapid Pro Automatic is a ball bonder. The Rapid Pro Automatic supports automatic magazine material handling.^[1]^[2]

Rapid Pro Automatic — Inventory photo — Fig. 01Rapid Pro AutomaticInventory photo^[1]

Power

200 / 220 / 240 VAC^[1]

Vacuum

3.52 kg/cm²^[2]

Performance

2 µm^[1]

What it is

The Kulicke & Soffa Rapid Pro Automatic is an automatic wire bonder used in semiconductor assembly and packaging.^[1]^[2]

The Rapid Pro is a K&S Gen-S series automatic wire bonder and a ball bonder.^[4]^[2]

How it works

The Rapid Pro includes automatic magazine material handling, real-time process monitoring and diagnostics, advanced traceability, and placement accuracy of 2 µm at 3 sigma.^[1]^[2]

Where it fits in the process flow

General reference — not yet source-verified

The Rapid Pro sits in back-end semiconductor assembly after device fabrication and before final package completion.

Applications

The Rapid Pro is used for semiconductor packaging and bonding applications that require wire attachment between the device and package structure.^[1]^[2]

The Rapid Pro supports gold, copper, and silver wire in the range from 0.6 to 2.5 mil.^[1]^[2]

What do the numbers mean?

Power & electrical4

Power supply: 200-240 VAC, -15% to 10%, single phase, 50/60 Hz, 2.6 kVA^[2]
Voltage: 200 / 220 / 240 VAC^[1]
Frequency: 50/60 Hz^[1]
Phase: Single phase^[1]

Vacuum & pumping2

Air pressure: 3.52 kg/cm²^[2]
Air Pressure: 3.52 kg/sq cm^[2]

Optics & imaging1

Vision system: Higher resolution progressive scan, CCD camera + dual magnification (2x & 6x), optional programmable focus^[3]

Performance4

Bond placement accuracy (3 sigma): 2 µm^[1]
Bond placement accuracy (3 sigma): 20 µm^[3]
Placement Accuracy: 2 µm^[2]
Placement accuracy: 2 um bond placement accuracy at 3 sigma^[1]

Dimensions & facilities7

Minimum loop height: 40 µm (with 0.6 mil wire)^[3]
Net weight: 590 kg^[2]
Dimensions (base machine with MHS): 889 x 1003 mm^[2]
Magazine dimensions: 305 x 110 x 178 mm^[2]
Leadframe dimensions: 300 x 92 mm^[2]
Minimum Loop Height: 40 µm^[2]
Overall Dimensions (Base Machine with MHS): x 889 x 1003 mm (first dimension not stated)^[2]

Configuration & options30

Power: Approx. 2.6 kVA^[1]
Wire size (Au, Cu, Ag): 0.6 to 2.5 mil^[1]
Bonding area X: 56 mm^[2]
Bonding area Y (standard): 80 mm^[3]
Bonding area Y (LA variant): 87 mm^[3]
Bonding area Y (ELA variant): 80 mm^[3]
Bonding method: Ball bonder^[2]
Maximum wire length: 76 mm (with 1.0 mil wire)^[3]
Wire pitch: 35 µm^[2]
Wire sway: 25 µm (wire length ≤ 2.54 mm)^[2]
Air consumption: 185 L/min^[2]
Same leadframe type conversion time: 4 min^[2]
Different leadframe type conversion time: 8 min^[2]
Die pad downset: Up to 2.3 mm^[2]
ROHS compliant: Yes^[3]
Bonding Area (X x Y): 56 x 80 mm^[2]
Bonding Wire Length: 7.6 mm^[2]
Different Leadframe Type: 8 min (change time?)^[2]
Gold Wire Size: 0.6 to 2.5 mil^[2]
Same Leadframe Type: 4 min (change time?)^[2]
Wire Sway: 25 µm^[2]
Power Consumption: Approx. 2.6 kVA^[1]
Current: 15 A^[1]
Manufacturer: Kulicke & Soffa Industries, Inc.^[2]
Model: Rapid Pro Automatic^[1]
Type: Automatic wire bonder^[1]
Material handling: Automatic magazine material handling^[1]
Wire size: 0.6 to 2.5 mil Au, Cu, and Ag wire^[1]
Bonding area: 56 mm x 80 mm^[2]
Vintage: 2020^[1]

Vintage & configurations

Documented models & variants

Designation	Generation	Vintage	Changes	Source
RAPID Pro LA	—	—	Large Area bonding: Y axis 87 mm	scribd.com^[3]
RAPID Pro ELA	—	—	Extended Large Area bonding: Y axis 80 mm	scribd.com^[3]
RAPID Pro LA (Large Area)	—	—	Large area bondable area configuration	zaratech.biz^[4]
RAPID Pro ELA (Extended Large Area)	—	—	Extended large area bondable area configuration	zaratech.biz^[4]

Interested in this tool?

Need help with this tool?Embed spec card

What replaced it?

Alternatives

Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.

Besi DS 9000 E— Same function class: Packaging & Bonding, nullCompare in depthsource^[5]

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Power supply200-240 VAC, -15% to 10%, single phase, 50/60 Hz, 2.6 kVA^[2]
Air pressure3.52 kg/cm²^[2]
Air Pressure3.52 kg/sq cm^[2]
Voltage200 / 220 / 240 VAC^[1]
Frequency50/60 Hz^[1]
PhaseSingle phase^[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Worked with this tool? Help preserve its knowledge →

Frequently asked questions

How does alignment work on an automatic wire bonder?General reference — not yet source-verified

Alignment is performed using pattern recognition systems that capture images of the die pads and substrate features. The machine compares these images to stored reference patterns and adjusts the bond head position accordingly to achieve precise placement of bonds, compensating for any die shift or substrate variation.

What factors affect bond quality in automatic wire bonders?General reference — not yet source-verified

Bond quality depends on several process parameters including ultrasonic energy, bond force, temperature, tool condition, wire feed, and the cleanliness of bond surfaces. Real-time monitoring systems on modern bonders measure bond force and displacement to detect variations and ensure consistent quality.

Not publicly documented

The following facts about the Rapid Pro Automatic are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Rapid Pro Automatic are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Rapid Pro Automatic are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Rapid Pro Automatic are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Rapid Pro Automatic is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Rapid Pro Automatic are on record.
Answerable by: an OEM parts catalog or a service engineer