Waferpedia

Kulicke & Soffa

Rapid

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The K&S Rapid is a wire bonder. The Rapid is configured for single-phase power, and its largest load has a current rating of 4.6 A.[1]

Rapid — Inventory photo
Fig. 01RapidInventory photo[1]

What it is

General reference — not yet source-verified

The Kulicke & Soffa Rapid belongs to the class of automatic thermosonic wire bonders, which are precision assembly systems used to create electrical interconnections between a semiconductor die and its package or substrate. Machines of this class are a critical part of the back-end semiconductor manufacturing process, where they attach fine wires—typically gold, copper, or silver—from bond pads on the die to corresponding leads or pads on the package.

What do the numbers mean?

Power & electrical4

Single Phase[1]
Accurate?
Electrical Configuration
Single Phase[1]
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Power
Single Phase - Current Rating of Largest Load: 4.6 A[1]
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Phase
Single Phase[1]
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Configuration & options5

Current Rating of Largest Load
4.6 A[1]
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Make
K&S[4]
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Model
Rapid[4]
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Machine Type
Wire Bonder[4]
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Vintage
2020[4]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • ConfigurationSingle Phase[1]
  • Electrical ConfigurationSingle Phase[1]
  • PowerSingle Phase - Current Rating of Largest Load: 4.6 A[1]
  • PhaseSingle Phase[1]

Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

How does the speed of a wire bonder affect production throughput?General reference — not yet source-verified

The bond speed, measured in bonds per second, directly determines the throughput of the packaging line. Faster machines reduce cycle time per device, increasing overall factory output. However, speed must be balanced with bond quality and yield, as excessive speed can lead to bond defects or wire sweep issues.

What types of defects can occur during the wire bonding process?General reference — not yet source-verified

Common defects include non-stick or lifted bonds, wire tail breakage, wire sagging, bond deformation, and short circuits due to wire sweep. Process optimization and inline inspection systems help minimize these defects and maintain high yields.

Can this class of machine handle different package types without tooling changes?General reference — not yet source-verified

Many wire bonders in this class are designed with flexible work holders and programmable bond patterns, allowing them to accommodate various package sizes and lead counts with quick recipe changes. However, specific tooling may be needed for different die sizes or bond pad pitches.

What is the typical maintenance requirement for a wire bonder?General reference — not yet source-verified

Regular maintenance includes cleaning or replacing the capillary tool, calibrating bond parameters, checking wire tension, and cleaning optics. Preventive maintenance schedules vary by usage but often involve periodic checks to ensure consistent bond quality and machine uptime.

Not publicly documented

The following facts about the Rapid are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Rapid are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the Rapid are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the Rapid are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Rapid are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the Rapid is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]Inventory photo
  3. [3]Inventory photo
  4. [4]Equipment inventory listing
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Last updated Sep 30, 2026.

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