Kulicke & Soffa
Maxum
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedWire bonding typically uses a combination of heat, pressure, and ultrasonic energy to attach a wire to bond pads on the die and then to the package substrate. A capillary tool feeds and positions the wire, while a wire clamp and flame-off system cut and form the ball or wedge bonds.
Where it fits in the process flow
General reference — not yet source-verifiedWire bonding is performed during back-end semiconductor assembly, after die attach and before encapsulation or molding. The process connects the die's input/output pads to the leadframe or substrate, completing the electrical path between the chip and the external package terminals.
Why won't it start?
Documented failure modes, common issues, and field considerations.
- Non-operational
What do the numbers mean?
Configuration & options4
- Non-operational[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What loop shapes can these machines achieve?General reference — not yet source-verified
The capillary deflection and wire pay-out are controlled to create various loop profiles—including low-, standard-, and high-loop shapes—depending on the package design, clearance requirements, and performance needs. Machine control software allows loop parameters to be adjusted per package type.
Not publicly documented
The following facts about the Maxum are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Maxum are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Maxum are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Maxum are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the Maxum is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Maxum are on record.
Answerable by: an OEM parts catalog or a service engineer
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]Equipment inventory listing
- [3]Equipment inventory listing
Last updated Oct 1, 2026.
Compare with similar tools
View all →
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
The Logitech 1 WBS 1 is a wafer substrate bonder for 6-inch wafers.
