Kulicke & Soffa
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The ConnX Elite is a high-speed automatic wire bonder from Kulicke & Soffa. The ConnX Elite achieves 3.0 μm accuracy at 3 sigma. The ConnX Elite supports a bondable area of 56 x 80 mm.[1][2]

The ConnX Elite sits in the semiconductor back-end assembly flow, after die preparation and before final package completion.
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| ConnX ELITE Opto LA (Large Area) | — | — | Field Upgrade Path variant | zaratech.biz[5] |
| ConnX ELITE Opto ELA (Extended Large Area) | — | — | Field Upgrade Path variant | zaratech.biz[5] |
| ConnX ELITE Opto LA | — | — | Field Upgrade Path variant | waferpedia.com[4] |
| ConnX ELITE Opto ELA | — | — | Field Upgrade Path variant | waferpedia.com[4] |
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The following facts about the ConnX Elite are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the ConnX Elite are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the ConnX Elite are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the ConnX Elite are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the ConnX Elite is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the ConnX Elite are on record.
Answerable by: an OEM parts catalog or a service engineer
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Last updated Oct 11, 2026.
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