Waferpedia

Kulicke & Soffa

3600 Plus

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Kulicke & Soffa 3600 Plus is a wire bonder. The Kulicke & Soffa 3600 Plus is a ribbon bonder. The Kulicke & Soffa 3600 Plus is placed in the Packaging & Bonding category.[1][2]

3600 Plus — Inventory photo
Fig. 013600 PlusInventory photo[3]

What it is

The Kulicke & Soffa 3600 Plus is a wire bonder used in packaging and bonding.[3][1][4][2]

How it works

General reference — not yet source-verified

A wire bonder joins conductors between a die or substrate and its package or interconnect points by placing a bond at controlled positions with a bonding tool.

Where it fits in the process flow

General reference — not yet source-verified

The 3600 Plus belongs in the back-end packaging flow, where bonding equipment makes electrical interconnects after die placement and before final package completion.

Applications

The 3600 Plus is used for packaging and bonding work in semiconductor manufacturing.[2][3]

What do the numbers mean?

Power & electrical3

Transducer
60/80 kHz[1]2 sources
Accurate?
Power consumption
5 A at 230 V[1]2 sources
Accurate?
Power requirement
180-240 VAC, Single Phase, 50/60 Hz[1]2 sources
Accurate?

Control & software1

Operating system
VX Works and Windows XP[1]2 sources
Accurate?

Dimensions & facilities1

Footprint
680 mm x 1308 mm[1]2 sources
Accurate?

Configuration & options21

Model
3600 Plus[3]
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Asset #
74055[3]
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Description
Wire Bonder[3]
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Category
Packaging & Bonding[2]
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Description
Ribbon Bonder[1]
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Wire diameter range
125 to 625 microns[4]
Accurate?
Z travel
50 mm[1]
Accurate?
Theta travel
+/- 220°[1]
Accurate?
Focus
30 mm (Programmable Range)[1]
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Monitor
Flat Panel, 17"[1]
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Forcer
50 - 1500 gr[1]
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Wire range
100 to 500 μm[1]2 sources
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Maximum wire looping
40.0 mm[1]2 sources
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Die rotation
+/- 70°[1]2 sources
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Pattern recognition type
Enhanced OE GS III[1]2 sources
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Connectivity
Ethernet, USB[1]2 sources
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Storage
Hard Disk Drive (HDD)[1]2 sources
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Certification
CE Certification[1]2 sources
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Bond area X
250 mm[1]2 sources
Accurate?
Bond area Y
150 mm[1]2 sources
Accurate?
Manufacturer
Kulicke & Soffa (K&S)[1]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Transducer60/80 kHz[1]
  • Power consumption5 A at 230 V[1]
  • Power requirement180-240 VAC, Single Phase, 50/60 Hz[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

How does the machine ensure consistent bond quality?General reference — not yet source-verified

Modern wire bonders use closed-loop process control, real-time monitoring of bond force, ultrasonic power, and temperature. Vision systems and post-bond inspection help detect defects such as lifted bonds or wire sag.

What are typical factors affecting throughput in wire bonding?General reference — not yet source-verified

Throughput is influenced by bond pad pitch, wire loop length, the number of bonds per package, and the speed of the bond head. Optimization of bonding parameters and material handling reduces cycle time.

Can this class of machine handle fine-pitch packages?General reference — not yet source-verified

Yes, automatic wire bonders are designed for fine-pitch applications, capable of bonding pad pitches in the range commonly used in advanced packaging. Precision motion control and small capillary sizes enable reliable interconnections.

What maintenance is typically required for wire bonding machines?General reference — not yet source-verified

Routine maintenance includes cleaning or replacing the capillary, checking wire tension, calibrating the bond head, and cleaning ultrasonic transducers. Periodic software updates and alignment verification ensure consistent performance.

Not publicly documented

The following facts about the 3600 Plus are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 3600 Plus are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 3600 Plus are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 3600 Plus are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 3600 Plus are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 3600 Plus is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]wotol.com — wotol.comwotol.com
  2. [2]waferpedia.com — waferpedia.comwaferpedia.com
  3. [3]Inventory photo
  4. [4]antycip.com — antycip.comantycip.com
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Last updated Oct 3, 2026.

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