KLA
HRP 340
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedThickness measurement tools of this class operate by applying a known force to a diamond-tipped stylus and recording vertical displacement as the stylus moves laterally across the substrate.
Where it fits in the process flow
General reference — not yet source-verifiedThickness measurement tools are used after deposition, chemical-mechanical planarization, or etch steps to verify that film thicknesses remain within process specifications and to provide feedback for process control.
Applications
General reference — not yet source-verifiedPrecision profilometers of this class are used for measuring step heights, film stress, and surface roughness on product wafers as well as on monitor or test wafers during process development and production monitoring.
What do the numbers mean?
Power & electrical2
Wafer handling2
Configuration & options2
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Parts & consumables
Tracked replaceable assemblies, spares criticality, and availability status across all major subsystems. Each entry cites its source.
- KLA HRP 340 Service WorkIn Productionsource[3]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the HRP 340 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the HRP 340 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the HRP 340 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the HRP 340 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the HRP 340 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the HRP 340 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]waferpedia.com — waferpedia.comwaferpedia.com
- [3]Equipment inventory listing
- [4]KLA 2135 vs KLA HRP 340 Thickness Measurement | Waferpedia — waferpedia.comwaferpedia.com
Last updated Sep 24, 2026.
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