Hitachi
Kokusai DD 802 V H
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedA diffusion furnace exposes wafers to elevated temperature while process gases flow through a heated reaction chamber. The wafer boat holds the wafers in a vertical stack that loads into the furnace tube. Heating elements surrounding the tube maintain a uniform temperature profile across the load.
The gas delivery system sets the process atmosphere by introducing reactive or inert species into the tube. Thermal processing drives solid-state reactions at the wafer surface, such as dopant incorporation or oxide growth.
Where it fits in the process flow
General reference — not yet source-verifiedThermal processing appears at multiple stages of the front-end fabrication flow. Diffusion furnaces perform oxidation, drive-in, and anneal steps that follow lithographic patterning.
The furnace step receives cleaned, patterned wafers and prepares them for subsequent film deposition or metallization.
Applications
General reference — not yet source-verifiedDiffusion furnace equipment is applied to thermal oxidation of silicon. The equipment class is also used for dopant diffusion and drive-in of implanted layers. Annealing of implanted layers is another application of this equipment class.
Some systems of this class also perform low-pressure chemical vapor deposition of thin films on wafers.
What do the numbers mean?
Power & electrical1
Configuration & options1
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- ModelDD 802 V H[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the Kokusai DD 802 V H are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the Kokusai DD 802 V H are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Kokusai DD 802 V H are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Kokusai DD 802 V H are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Kokusai DD 802 V H are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Kokusai DD 802 V H are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (6)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]Equipment inventory listing
- [3]Equipment inventory listing
- [4]Equipment inventory listing
- [5]Equipment inventory listing
- [6]Equipment inventory listing
Last updated Sep 28, 2026.
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