Hesse & Knipps
BJ 820 V 1 Wedge
The Hesse & Knipps BJ 820 V 1 Wedge Bonder is a wedge bonder for semiconductor packaging. The BJ 820 V 1 Wedge Bonder features a 45° bond head. The BJ 820 V 1 Wedge Bonder can handle fine wire up to 2.7 mils.[1]
Plate 01HESSE Thin Wedge Bonder BJ820 Multi stitch looping Repeatability Sim
세정반도체Watch on YouTubePlate 02HESSE Thin Wedge Bonder BJ820 Fast Bonding
세정반도체Watch on YouTube
What it is
How it works
Where it fits in the process flow
General reference — not yet source-verifiedA wedge bonder is used after devices have been prepared for assembly and before the package is completed.
Applications
The BJ 820 V 1 is used for fine-wire wedge bonding in packaging and bonding operations.[1]
What do the numbers mean?
Vacuum & pumping1
- Vacuum Pump[1]
Control & software2
- Lastest Software Installed[1]
Configuration & options10
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- ASM AB 559 A 06 Wedge— Same function class: Packaging & Bonding, UnknownCompare in depthsource[2]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- ConfigurationVacuum Pump[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the BJ 820 V 1 Wedge are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the BJ 820 V 1 Wedge are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the BJ 820 V 1 Wedge are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the BJ 820 V 1 Wedge are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the BJ 820 V 1 Wedge are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the BJ 820 V 1 Wedge is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Equipment inventory listing
- [3]ASM AB 559 A 06 Wedge vs Hesse & Knipps BJ 820 V 1 Wedge comparison | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 10, 2026.
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