Heller
788
The Heller 788 is an in-line, continuous cure, vertical format curing oven. The Heller 788 conveys product up, across and back down to the line in a continuous stream with cycle times as short as 25 seconds. The Heller 788 has four internal thermal zones with independent time and temperature controls.[1]
What it is
The Heller 788 is an in-line, continuous cure, vertical format oven for epoxy curing in electronics assembly. The machine is designed to automate the epoxy cure process, reducing labor and improving process consistency compared to batch ovens. The Heller 788 is part of a family of vertical format ovens from Heller Industries that occupy unused air space rather than floor space.[1][3][4]
Where it fits in the process flow
The Heller 788 is used for in-line epoxy cure processes in electronics manufacturing, typically after dispensing operations such as die attach, flip chip underfill, or chip-on-board encapsulation. The machine replaces batch ovens, eliminating the labor needed to load and unload batch ovens and reducing time and temperature variations caused by frequent opening of oven doors. The continuous flow allows product to move directly from the assembly line into the oven and back, integrating with SMT or semiconductor back-end production lines. The oven can be configured with customized heights of 7, 8, 9, and 10 feet to meet various throughput requirements.[1][3][4]
What can it run?
Process applications and technology nodes documented for this tool.
- die attach
- flip chip underfill
- COB encapsulation
- epoxy cure
What do the numbers mean?
Wafer handling2
- pitch between product carriers
- 3/8 to 1 1/2 inches (9.5 to 38 mm) in 3/8-inch (9.5 mm) increments[1]
Control & software1
Dimensions & facilities6
Configuration & options16
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the minimum cycle time of the Heller 788?
The Heller 788 can achieve cycle times as short as 25 seconds.[1][3][4]
How many thermal zones does the Heller 788 have?
The Heller 788 has four internal thermal zones with independent time and temperature controls.[1][3][4]
What conveyor width range does the Heller 788 support?
The conveyor width is adjustable from two to 18 inches (5 to 46 cm).[1][3][4]
Can the Heller 788 handle thin circuit boards?
Yes, it can handle boards as thin as 0.015 inch (0.4 mm).[1][3][4]
Not publicly documented
The following facts about the 788 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 788 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 788 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 788 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 788 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 788 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]web.archive.org — web.archive.orgweb.archive.org
- [3]Heller 788 Vertical Format Oven — semiconductoronline.comsemiconductoronline.com
- [4]Vertical Curing Oven - Heller 788 — smtnet.comsmtnet.com
Last updated Sep 26, 2026.
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