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Filmetrics

F80

Legacythin-film thickness measurement systemIntroduced Filmetrics F80 family
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F80 — web.archive.org
Fig. 01F80web.archive.org[1]

Introduced

2001

Performance

industry-leading throughput[1]

Where it fits in the process flow

The F80 is positioned as an in-line metrology tool for semiconductor manufacturing. The F80 is particularly suited for measuring product wafers during normal wafer transfer, without removing samples from the production line. The F80 supports wafers up to 300 mm in diameter, including patterned and unpatterned substrates. The F80 is used for measurement of CVD and CMP patterned wafers. The F80's measurements agree with ex-situ benchmark measurements to better than 1%.[3][4]

Applications

The F80 is used for in-line thickness uniformity monitoring in chemical mechanical polishing (CMP) processes. The F80 is also used for run-to-run feedback control in chemical vapor deposition (CVD) and atomic layer deposition (ALD) processes. The F80 supports measurement of films such as SiO2, Si3N4, low-k dielectrics, photoresists, metal oxides, and epitaxial III-V layers. The F80 is also applicable to etch process monitoring for depth profiling.[4]

  • product wafers
  • patterned wafers
  • ILD thickness measurement
  • wafer thickness mapping
  • process control for semiconductor manufacturing

What do the numbers mean?

Wafer handling10

target wafers
patterned wafers[1]
Accurate?
in-line capability
maps ILD thickness on product wafers during normal wafer transfer[3]
Accurate?
measurement coverage
maps 100% of a wafer's surface in under 3 seconds[3]
Accurate?
measurement path
measurements are taken through the transfer chamber viewport[3]
Accurate?
Full wafer mapping time
Under 3 seconds[3]
Accurate?
Measurement mode
in-line product wafer thickness mapping[3]
Accurate?
Maps wafer surface
100% of a wafer's surface[3]
Accurate?
Wafer size compatibility
up to 300 mm (12-inch) diameter[4]
Accurate?
Supported wafer types
CVD and CMP patterned wafers[3]
Accurate?
Configurations
manual load tabletop systems to fully automated cassette-to-cassette tools[1]
Accurate?

Performance2

throughput claim
industry-leading throughput[1]
Accurate?
Measurement accuracy
Better than 1% agreement with ex-situ benchmarks[3]
Accurate?

Configuration & options10

measurement type
thin-film thickness mapping system[1]
Accurate?
technology
Thickness Imaging[1]
Accurate?
measurement speed
as fast as 15 points in 21 seconds[1]
Accurate?
integration
does not require a dedicated metrology chamber and can be integrated onto existing equipment[3]
Accurate?
Multi-point measurement speed
15 points in 21 seconds[1]
Accurate?
Measurement technique
Thickness Imaging (multipoint spectral reflectance)[1]
Accurate?
Measurement type
thin-film thickness measurement system[2]
Accurate?
Measurement approach
thickness imaging[2]
Accurate?
Mapping speed
under 3 seconds[3]
Accurate?
Measurement timing
as fast as 15 points in 21 seconds[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
F80-T———web.archive.org[1]
F80-C———instrumenthive.com[4]
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Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What is the maximum wafer size the F80 can measure?

The F80 supports wafers up to 300 mm (12-inch) diameter.[4]

How fast can the F80 perform measurements?

The F80 can measure 15 points in 21 seconds, and can map a wafer's surface in under 3 seconds.[1][2][3]

Can the F80 be integrated into existing equipment?

Yes, the F80 can be integrated onto existing equipment without modification to the vacuum chamber, using a viewport for measurements.[3]

What measurement principle does the F80 use?

The F80 uses spectroscopic reflectometry, based on broadband spectral reflectance analysis.[4]

What types of films can the F80 measure?

The F80 can measure SiO2, Si3N4, low-k dielectrics, photoresists, metal oxides, and epitaxial III-V layers.[4]

Is the F80 suitable for in-line metrology?

Yes, the F80 is designed for in-line measurement of product wafers during normal wafer transfer, without removing samples from the production line.[3]

Not publicly documented

The following facts about the F80 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the F80 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the F80 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the F80 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the F80 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the F80 are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
  2. [2]web.archive.org — web.archive.orgweb.archive.org
  3. [3]web.archive.org — web.archive.orgweb.archive.org
  4. [4]instrumenthive.com — instrumenthive.cominstrumenthive.com
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Last updated Oct 5, 2026.