Fico
AMS I 306 Mold Chase
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedIn a transfer molding press, the mold chase is mounted in the press and heated. A preheated mold compound pellet is placed into a transfer pot, and a plunger forces the molten compound into the mold cavity through a runner system. The chase contains the cavity and the details for forming the package outline, including gates and vents.
Where it fits in the process flow
General reference — not yet source-verifiedIn semiconductor packaging, the mold chase is used in the encapsulation step after die attach and wire bonding. The assembly—such as a leadframe with attached dies and wires—is placed in the mold chase, and the molding compound is injected to form the final package body.
Downstream processes include post-mold curing, deflashing, trim and form, and plating. The mold chase directly determines the package dimensions and the quality of the encapsulation.
Applications
General reference — not yet source-verifiedTypical materials molded include epoxy molding compounds (EMCs) formulated for low stress and high thermal conductivity. The chase can also accommodate different package sizes by using interchangeable cavity inserts.
What do the numbers mean?
No specifications recorded yet
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Where are the manuals?
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Not publicly documented
Field notes
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Not publicly documented
The following facts about the AMS I 306 Mold Chase are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the AMS I 306 Mold Chase are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the AMS I 306 Mold Chase are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the AMS I 306 Mold Chase are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the AMS I 306 Mold Chase are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the AMS I 306 Mold Chase are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]AMS I 306 Mold Chase — Fico | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 4, 2026.
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