Esec
2100 FC
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Esec 2100 FC hS is a flip chip die bonder. The Esec 2100 FC hS achieves a bonding accuracy of 8 µm at 3 sigma. The Esec 2100 FC hS supports wafer sizes from 4 to 12 inches.[1][2]
What it is
How it works
Where it fits in the process flow
Applications
The Esec 2100 FC hS is intended for FCOL, FC-MIS, FC-SIP, FCCSP, FCBGA, and CSP-LED applications.[1]
The Esec 2100 FC hS supports die sizes from 0.2 mm to 20 mm and die thickness at or above 0.05 mm, and the Esec 2100 FC plus reports die sizes from 0.5 mm to 20 mm and die thickness at or above 0.1 mm.[1][4]
Why won't it start?
Documented failure modes, common issues, and field considerations.
- Multiple missing parts are listed in the source.
- Missing parts: Output indexing clamp cable, Bond Z motor, Bond Z timing belt, Bond Z encoder, Bond Z encoder flat cable, Input pusher timing belt, Frame pusher Y direct motor, Hammer board, Bond head, Dispenser stepper motor X axis.
What do the numbers mean?
Wafer handling3
Performance1
Dimensions & facilities4
Configuration & options10
Vintage & configurations
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What typical die sizes and substrate sizes can a flip chip bonder of this class handle?General reference — not yet source-verified
Flip chip bonders are designed to accommodate a range of die sizes, from very small (mm-scale) to large (tens of mm), and substrates can vary from small carrier strips to large panel substrates, depending on the specific model's work area and tooling capabilities. The class generally supports multiple formats with changeable chucks and collets.
How is die-to-substrate alignment accuracy achieved?General reference — not yet source-verified
Most flip chip bonders use dual vision systems (one directed at the die, one at the substrate) to capture alignment marks, then calculate positional offsets. The placement head adjusts X, Y, and theta in real time, enabling placement accuracy typically within a few micrometers. Some systems also use a split-field microscope or through-the-lens illumination to see through the die for transparent substrates.
What types of bumps are compatible with this class of machine?General reference — not yet source-verified
The class generally supports solder bumps, gold stud bumps, copper pillars, and other contact bump types. The bonder may include a flux dipping or flux spray station to prepare the bumps for soldering. The placement tooling is designed to handle various bump geometries and pitches.
Does the bonder perform reflow, or is a separate reflow oven needed?General reference — not yet source-verified
Some flip chip bonders integrate a heated stage to reflow the solder immediately after placement, while others require a separate reflow oven for the assembled substrate. The choice depends on the machine configuration and process requirements; the class includes both options.
What are typical throughput capabilities for machines of this class?General reference — not yet source-verified
Throughput varies widely based on die size, accuracy requirements, and process complexity, but flip chip bonders generally achieve from several hundred to several thousand placements per hour. Multi-head designs and automation features (e.g., wafer mapping, substrate pre-alignment) can increase throughput for high-volume applications.
Not publicly documented
The following facts about the 2100 FC are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2100 FC are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 2100 FC are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the 2100 FC is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 2100 FC are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the 2100 FC are on record.
Answerable by: university cleanroom staff or an OEM application specialist
Sources & citations
Sources (6)Every fact above is drawn from these public sources
- [1]besi.com — besi.combesi.com
- [2]waferpedia.com — waferpedia.comwaferpedia.com
- [3]semiconductor.directory — semiconductor.directorysemiconductor.directory
- [4]micro-power.com.hk — micro-power.com.hkmicro-power.com.hk
- [5]2100 FC Flip Chip — Esec | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
- [6]Equipment inventory listing
Last updated Oct 2, 2026.
Compare with similar tools
View all →
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
The Logitech 1 WBS 1 is a wafer substrate bonder for 6-inch wafers.
