Electroglas
EG 4060
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedA wafer prober loads a wafer onto a precision stage and positions it beneath a probe card. The probe card contains a set of fine needles or tips that align with the bond pads of each die. The stage moves the wafer in the X and Y directions to bring each die sequentially under the probe tips, and a z-axis motion brings the tips into contact with the pads. A test head mates with the probe card and connects to a tester that sends electrical signals and measures responses. After testing one die, the stage indexes to the next die until the entire wafer is probed.
The EG 4060 uses a standard wafer prober architecture: a wafer handling system, an alignment system to align the wafer to the probe card, a chuck that holds the wafer by vacuum, and a controller that orchestrates stepping and contact sequences. The machine can be integrated with automatic test equipment for volume testing in a semiconductor fab or test facility.
Applications
General reference — not yet source-verifiedWafer probers are also employed in process development and characterization, where they help evaluate new process technologies or device designs by providing early electrical data from test wafers.
What do the numbers mean?
No specifications recorded yet
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Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the EG 4060 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the EG 4060 are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the EG 4060 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the EG 4060 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the EG 4060 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the EG 4060 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]EG 4060 — Electroglas | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 5, 2026.
