Disco
DTG 8440 Taiko
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
The model designation is DTG 8440, and the equipment name associated with it is Disco DTG 8440 Taiko Grinder.[2]
How it works
General reference — not yet source-verifiedA dicing and grinding machine combines mechanical thinning with wafer singulation-related processing. In this class of equipment, a wafer is held on a support system while abrasive or cutting actions remove material from the back side or along planned separation lines, depending on the process sequence used.
Where it fits in the process flow
General reference — not yet source-verifiedThis type of equipment sits in the back-end wafer process flow, after front-end device fabrication and before or alongside separation into individual dies. Grinding is used when wafer thinning is needed, and dicing is used when chips must be separated from the wafer.
Applications
General reference — not yet source-verifiedMachines of this class are used for semiconductor wafers that need thinning, singulation, or both. They are common in packaging-related flows where finished wafer thickness and controlled die separation are important.
What do the numbers mean?
Wafer handling8
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the DTG 8440 Taiko are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DTG 8440 Taiko are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DTG 8440 Taiko are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DTG 8440 Taiko are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DTG 8440 Taiko are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DTG 8440 Taiko is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]Equipment inventory listing
Last updated Sep 22, 2026.
Compare with similar tools
View all →
The Lapmaster Model 15 is a bench-mounted unit with a rigid, lightweight, cast aluminum base, of the 'ring lapper' configuration, enabling high standards of flatness and surface finish.
General referenceThe Blanchard 18 D Surface is a vertical-spindle rotary-table surface grinding machine used to produce flat, parallel surfaces on metal workpieces.
The Blanchard 20 36 Surface is a surface grinder used in dicing and grinding applications.
