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A laser saw separates wafer material along programmed cut paths by directing a focused laser beam to create a narrow separation line.
Laser sawing is used where controlled material removal or separation is needed without the mechanical contact of a blade-based dicing process.
A laser saw sits in the wafer singulation stage after front-end device processing and before die handling or assembly.
The DFL 7161 FX is a dicing-and-grinding machine family member in process terms, and such equipment is used to prepare individual dies from processed wafers.
Laser sawing is used for wafer dicing and singulation in semiconductor manufacturing.
Laser sawing is applied to material separation tasks that benefit from narrow cuts and reduced mechanical contact.
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The following facts about the DFL 7161 FX are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFL 7161 FX are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFL 7161 FX are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFL 7161 FX are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DFL 7161 FX are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DFL 7161 FX is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 5, 2026.
The Lapmaster Model 15 is a bench-mounted unit with a rigid, lightweight, cast aluminum base, of the 'ring lapper' configuration, enabling high standards of flatness and surface finish.
General referenceThe Blanchard 18 D Surface is a vertical-spindle rotary-table surface grinding machine used to produce flat, parallel surfaces on metal workpieces.
The Blanchard 20 36 Surface is a surface grinder used in dicing and grinding applications.