CyberOptics
SE500-II
The CyberOptics SE500-II is a 3D solder paste inspection system. The CyberOptics SE500-II has a maximum board size of 510 x 510 mm. The CyberOptics SE500-II has an inspection speed of 80 cm²/sec at 30 µm.[1]
What it is
The SE500-II handles boards from 50 mm by 50 mm up to 510 mm by 510 mm. Inspection speed is 80 cm² per second at 30 µm resolution and 50 cm² per second at 15 µm resolution. The system achieves a Gage Repeatability and Reproducibility (GR&R) of less than 10 percent at six sigma. The machine uses a sensor exclusively designed and built by CyberOptics, with no drift, no parts to wear, and no recalibration required. The all-in-one scan sequence merges fiducial, barcode, and raster scans into a single pass, yielding up to 30 percent cycle time improvement. The system runs the SPI V5 software, which includes a multi-touch interface. The SE500-II is closed-loop feedback ready and compatible with CyberPrint OPTIMIZER and mounter feed-forward systems.[1][4]
Where it fits in the process flow
General reference — not yet source-verifiedThe SE500-II is placed after the solder paste printer and before the pick-and-place machine in an SMT assembly line. The inspection verifies that paste deposition meets quality requirements before components are placed and reflowed. Results can be used to correct printer parameters in real time.
What can it run?
Process applications and technology nodes documented for this tool.
- Electronics Assembly Inspection
- Solder Paste Inspection
Why won't it start?
Documented failure modes, common issues, and field considerations.
- No drift stated
- No parts to wear stated
- No recalibration needed stated
What do the numbers mean?
Optics & imaging1
Control & software1
Dimensions & facilities13
Configuration & options12
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What types of defects can this class of machine detect?General reference — not yet source-verified
Metrology and inspection systems in this class can detect a wide range of defects including particles, scratches, pattern bridges, missing features, and film thickness variations. The specific detection capability depends on the illumination wavelength, optics resolution, and detection algorithms employed by the system.
How does this class of system differ from a scanning electron microscope (SEM)?General reference — not yet source-verified
Optical-based inspection systems typically offer higher throughput and can inspect wafers in air without vacuum, making them suitable for inline monitoring. SEMs provide higher resolution and are better for detailed defect review and critical dimension measurements, but operate at lower speed. The two are often complementary in a fab.
What is the typical throughput of such metrology systems?General reference — not yet source-verified
Throughput varies widely by system design, but class-level optical inspection tools are generally capable of inspecting multiple wafers per hour. Factors affecting throughput include inspection area, required resolution, and defect sensitivity settings.
Can this class of machine measure both frontside and backside defects?General reference — not yet source-verified
Many optical inspection systems are designed primarily for frontside inspection. Some advanced systems may include capabilities for backside inspection or edge inspection, but this depends on the specific tool configuration and options.
Is the system suitable for both research and production environments?General reference — not yet source-verified
Yes, such systems are commonly used in both R&D and high-volume manufacturing. In R&D, they support process development and characterization, while in production they provide routine inline monitoring to ensure yield and process stability.
Not publicly documented
The following facts about the SE500-II are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SE500-II are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the SE500-II are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the SE500-II are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the SE500-II is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the SE500-II are on record.
Answerable by: an OEM parts catalog or a service engineer
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]wotol.com — wotol.comwotol.com
- [3]bajabid.com — bajabid.combajabid.com
- [4]SE500-II™ – smtsamsung — smtsamsung.comsmtsamsung.com
Last updated Oct 5, 2026.
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