Cascade Microtech
300
Wafer size
300mm
Performance
precision and versatility[1]
What it is
How it works
General reference — not yet source-verifiedProbe stations in this class typically combine a stable wafer stage, precision motion, probe arms, and measurement accessories so the operator can align, contact, and characterize the device under test. Probe systems in this class are commonly paired with thermal control systems, calibration software, and specialized probes.
Where it fits in the process flow
General reference — not yet source-verifiedThe Cascade Microtech 300 fits in wafer-level test and characterization rather than in front-end wafer fabrication. The system is used after wafer processing steps that leave accessible test structures or device pads for electrical probing.
Applications
Probe stations of this class are also used for circuit boards, modules, vertical probe cards, MEMS, and electro-optic devices. Probe systems in this class support measurement work where the device must be contacted directly at wafer level.[2][3]
- RF/DC device characterization
- wafer-level reliability
- IC failure analysis and design debug
What do the numbers mean?
Wafer handling4
Performance1
Control & software1
Configuration & options2
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| CM300 | — | — | Described as a flexible on-wafer probe system that scales to meet evolving needs. | web.archive.org[1] |
| Elite 300 | — | — | Described as a probe station for RF/DC device characterization, wafer-level reliability, IC failure analysis, and design debug. | web.archive.org[1] |
| PM300 | — | — | Described as a manual probe station for semiconductor failure analysis and in-process testing. | web.archive.org[1] |
| PA300 | — | — | Described as a semi-automatic probe system configured with a vast array of accessories for wafer-level test. | web.archive.org[1] |
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is being measured with this class of equipment?General reference — not yet source-verified
Common measurements include electrical continuity, device behavior, parameter extraction, and other responses needed to evaluate semiconductor structures.
Why is precise alignment important?General reference — not yet source-verified
The contact points are small and localized, so accurate positioning is needed to make reliable electrical connection without damaging the sample.
Not publicly documented
The following facts about the 300 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 300 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 300 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 300 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 300 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 300 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]web.archive.org — web.archive.orgweb.archive.org
- [3]High Performance Probe Systems | On Wafer Probe Stations | Cascade Microtech, Inc. — web.archive.orgweb.archive.org
Last updated Oct 5, 2026.
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