Canon
FPA 3000 i 5 + Fine Pattern
The Canon FPA 3000 i 5 + Fine Pattern Aligner is a step-and-repeat lithography tool. The Canon FPA 3000 i 5 + Fine Pattern Aligner processes 6-inch wafers.[1][2]
What it is
How it works
General reference — not yet source-verifiedFine pattern aligners of this class are projection steppers. A reticle containing the pattern to be printed is illuminated by a uniform light source, and a reduction lens projects the image onto a photoresist‑coated wafer. The wafer is stepped to multiple exposure fields so that the entire surface is patterned in a step‑and‑repeat sequence.
What do the numbers mean?
Vintage & configurations
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- SUSS MicroTec MJB 4 Mask— Same function class: Lithography, nullCompare in depthsource[1]
- SUSS MicroTec MA 6 Mask— Same function class: Lithography, nullCompare in depthsource[1]
- SUSS MicroTec MA 200 Mask— Same function class: Lithography, nullCompare in depthsource[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
How does throughput compare between i-line steppers and other lithography tools?General reference — not yet source-verified
Steppers of this class typically offer moderate throughput, measured in wafers per hour, which is often lower than modern deep-UV scanners but adequate for many manufacturing environments. Throughput depends on exposure time per field, stage speed, and overhead for alignment and reticle changes.
What are the main maintenance considerations for an i-line stepper?General reference — not yet source-verified
Regular maintenance includes changing mercury arc lamps (which degrade over hundreds of hours), cleaning optical elements, recalibrating alignment and focus sensors, and maintaining the vacuum and chemical delivery systems. The mechanical stage and robotic handlers also require periodic inspection and lubrication.
Not publicly documented
The following facts about the FPA 3000 i 5 + Fine Pattern are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the FPA 3000 i 5 + Fine Pattern are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the FPA 3000 i 5 + Fine Pattern are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the FPA 3000 i 5 + Fine Pattern are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the FPA 3000 i 5 + Fine Pattern is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the FPA 3000 i 5 + Fine Pattern are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (7)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
- [6]Inventory photo
- [7]inventory listing
Last updated Sep 28, 2026.
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The SUSS MA 200 is a semi-automatic mask aligner capable of processing wafers up to 8 inches in diameter, using UV400 optics and a 365/405 nm sensor.
The SUSS MA 6 Mask Aligner is a semiconductor lithography tool used for mask alignment and exposure, supporting various wafer sizes and featuring infrared alignment and a split-field microscope.
The SUSS MJB 4 Mask Aligner is a mask aligner used for contact exposure and alignment, with source-stated support for wafers up to 4 inches in diameter.