ASM
iHawk V
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedIn wire-bonding configurations, the bonder feeds a fine wire through a capillary and forms a ball or wedge bond at each end. In die-bonding configurations, the bonder picks a die from a wafer or tape and places it onto a prepared substrate, often using an epoxy or solder preform.
Where it fits in the process flow
General reference — not yet source-verifiedUpstream processes include wafer sawing and die sorting; downstream processes include wire bonding verification, encapsulation, and singulation. The bonder is one of the critical tools in the packaging line that determines interconnection quality and yield.
Applications
General reference — not yet source-verifiedCommon applications include memory packages, logic devices, power modules, and MEMS packaging. The bonder handles a range of substrate materials such as leadframes, laminate substrates, and ceramic packages.
What do the numbers mean?
No specifications recorded yet
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Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the iHawk V are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the iHawk V are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the iHawk V are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the iHawk V are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the iHawk V are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the iHawk V are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]iHawk V — ASM | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 7, 2026.
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