ASM

Eagle XP

Deposition ASM Eagle family

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Eagle XP — Inventory photo — Fig. 01Eagle XPInventory photo^[1]

Power

P/N 1060-625-01^[2]

Vacuum

ALD/LL/WHC is Edwards IXH 1210^[2]

Gas delivery

500 SCCM, 3 SLM^[1]

What it is

The ASM Eagle XP is an atomic layer deposition system in the deposition category. The Eagle XP is configured for 12-inch wafers.^[1]^[2]

How it works

The Eagle XP includes a vacuum load port vacuum value of -86.2, gas LLC pressure values of 0.56 and 0.209 MPa, FI at 100 Pa, and differential at 3.5 Pa.^[1]^[2]

Where it fits in the process flow

General reference — not yet source-verified

An atomic layer deposition system sits in the thin-film deposition section of semiconductor processing. The Eagle XP is used after wafer preparation steps and before later patterning or integration steps that require deposited films.

Applications

General reference — not yet source-verified

Atomic layer deposition is used for thin films that require uniform coverage and precise thickness control. The process is commonly used for dielectric, barrier, and other conformal film applications.

What do the numbers mean?

Power & electrical1

Power Supply & AC Dist Box: P/N 1060-625-01^[2]

Vacuum & pumping3

Backing Pump(s): ALD/LL/WHC is Edwards IXH 1210^[2]
Vacuum Load Port Vacuum: -86.2^[2]
Gas LLC Pressure: 0.56/0.209 MPA^[2]

Wafer handling2

Robot Type: Yawuski^[2]
Wafer size: 12 inch^[1]

Gas & chemistry3

Ar: 500 SCCM, 3 SLM^[1]
N2: 500 SCCM^[1]
Gas delivery: Ar 500 SCCM, 3 SLM; N2 500 SCCM^[2]

Control & software1

System software version: 1.58a-001^[1]

Dimensions & facilities1

CDA LLC PN2: 403^[2]

Configuration & options12

XP Platform^[2]; HDD not included^[1]; All cables present^[1]; System SW (OS) Version 1.58a-001^[1]
Heater Jacket: Intraco Taiwan Corporation^[1]
DIW: 2.95^[1]
FI: 100 Pa^[1]
Differential: 3.5 Pa^[1]
Process: ALD (Atomic Layer Deposition)^[1]
Model: Eagle XP^[1]
HDD: not included^[1]
Cables: all cables present^[1]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Power Supply & AC Dist BoxP/N 1060-625-01^[2]
Backing Pump(s)ALD/LL/WHC is Edwards IXH 1210^[2]
Vacuum Load Port Vacuum-86.2^[2]
Gas LLC Pressure0.56/0.209 MPA^[2]
Ar500 SCCM, 3 SLM^[1]
N2500 SCCM^[1]
Gas deliveryAr 500 SCCM, 3 SLM; N2 500 SCCM^[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What type of deposition system is the Eagle XP?

The Eagle XP is an atomic layer deposition system.^[1]^[2]

Not publicly documented

The following facts about the Eagle XP are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Eagle XP are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Eagle XP are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Eagle XP are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Eagle XP are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Eagle XP is not on record.
Answerable by: an OEM datasheet or a fab qualification report