ASM
Eagle 60
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The ASM Eagle 60 is a gold wire bonder launched in 2002 by ASM Pacific Technology Ltd. The Eagle 60 was the industry's first production machine capable of 35-micron fine pitch bonding. The Eagle 60 offers 20-percent higher productivity than its predecessor model.[1]
Produced
2002–
Power
240 V[2]
What it is
General reference — not yet source-verifiedThe ASM Eagle 60 is a gold wire bonder used in semiconductor assembly and packaging. Wire bonders create electrical connections between an integrated circuit die and its package leads using fine metal wire.
How it works
General reference — not yet source-verifiedGold wire bonders such as the Eagle 60 typically use a thermosonic bonding process. A capillary tool feeds gold wire, and a combination of heat, pressure, and ultrasonic energy creates a weld between the wire and the bond pad on the die, followed by a second bond to the package lead or substrate.
Applications
The Eagle 60 was designed for bonding advanced integrated circuits used in power and communications end markets.[1]
What do the numbers mean?
Power & electrical3
- 50/60 Hz[2]
Configuration & options6
Vintage & configurations
- 2002Production start[1]
The Eagle 60 was launched in 2002.
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the finest bonding pitch the Eagle 60 can achieve?
The Eagle 60 is capable of 35-micron fine pitch bonding.[1]
When was the Eagle 60 introduced?
The Eagle 60 was launched in 2002.[1]
What type of wire does the Eagle 60 bond?
The Eagle 60 is a gold wire bonder.[1]
What is the power requirement of the Eagle 60?
The Eagle 60 operates on single-phase power at 50 or 60 Hz.[3]
What productivity improvement does the Eagle 60 offer over its predecessor?
The Eagle 60 offers 20 percent higher productivity than its predecessor model.[1]
Who manufactures the Eagle 60?
The Eagle 60 is manufactured by ASM Pacific Technology, a subsidiary of ASM International.[1]
Not publicly documented
The following facts about the Eagle 60 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented variants, configuration options, or revision breakpoints of the Eagle 60 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Eagle 60 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Eagle 60 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Eagle 60 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Eagle 60 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]web.archive.org — asm.com (Nov 9, 2014)web.archive.org
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
Last updated Oct 1, 2026.
Compare with similar tools
View all →
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
The Logitech 1 WBS 1 is a wafer substrate bonder for 6-inch wafers.
