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Applied Materials

P 5000 Mark II

DepositionWafer OrienterIntroduced Applied Materials P 5000 Mark II family
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The Applied Materials P 5000 Mark II is a plasma-enhanced chemical vapor deposition (PECVD) system used for depositing dielectric films on semiconductor wafers. The Applied Materials P 5000 Mark II processes 6-inch and 8-inch wafers in a multi-chamber configuration. The Applied Materials P 5000 Mark II can be equipped with chambers for silane-based SiO2 and SiN deposition.[1][2][3]

P 5000 Mark II — Inventory photo
Fig. 01P 5000 Mark IIInventory photo[2]

Wafer size

Wafer Orienter

Introduced

1991

Power

RF Generator Rack[2]

Vacuum

Edwards iH 80 Series[2]

Gas delivery

28[2]

What it is

General reference — not yet source-verified

The Applied Materials P 5000 Mark II belongs to the deposition class of process equipment. Such machines are used to place a material layer onto a substrate in a controlled vacuum or process environment, creating films that become part of an electrical, optical, or protective stack.

Machines of this class are a core part of thin-film manufacturing. They are built to produce repeatable coatings with controlled uniformity and adhesion so that downstream patterning, etching, or finishing steps can rely on a consistent starting surface.

How it works

General reference — not yet source-verified

The process is managed by controlling chamber conditions, substrate exposure, and the delivery of the film-forming material. By adjusting these parameters, machines of this class can form films with different compositions, thickness behaviors, and physical properties suited to the intended process.

Where it fits in the process flow

General reference — not yet source-verified

Deposition equipment is used early or midstream in the fabrication flow, after surface preparation and before pattern definition, etching, or other structuring steps that shape the deposited material into device features.

Applications

General reference — not yet source-verified

Machines of this class are generally used to create conductive, insulating, barrier, protective, or functional thin films on wafers and other precision substrates. These films support semiconductor devices, interconnect structures, optical coatings, and related layered products.

  • PECVD

What do the numbers mean?

Power & electrical3

RF Generator Rack[2]
Accurate?
Voltage
208VAC 50/60Hz[3]
Accurate?
RF Match Type
Phase IV[2]
Accurate?

Vacuum & pumping1

Load Lock Pump
Edwards iH 80 Series[2]
Accurate?

Wafer handling12

Center finder board retrofitted for transparent & opaque substrates[2]
Accurate?
Wafer size
Wafer Orienter[2]
Accurate?
Phase
Phase 3 Robot[2]
Accurate?
Phase
Phase 3 Cassette Handler[2]
Accurate?
Wafer Size (6 inch)
6 inch[2]
Accurate?
Wafer Size (8 inch)
8 inch[1]
Accurate?
Robot
Phase 3[2]
Accurate?
Cassette Handler
Phase 3[2]
Accurate?
Wafer Orienter
Yes[2]
Accurate?
Wafer sizes
8 inch[1]
Accurate?
Wafer sizes
6 inch[2]
Accurate?
Wafer orienter
Present[2]
Accurate?

Gas & chemistry7

Gas Panel Type
28[2]
Accurate?
CES Gas Panel[2]
Accurate?
Process
Plasma-Enhanced Chemical Vapor Deposition (PECVD)[1]
Accurate?
Gas Lines
N2, He, N2O, NH3, 2% SiH4/Bal He, CF4[2]
Accurate?
Line 1
N2, 3000 sccm, Brooks 5850 / 5964[2]
Accurate?
Line 2
He, 5000 sccm, Ditto[2]
Accurate?
Process type
PECVD (Plasma-Enhanced Chemical Vapor Deposition)[1]
Accurate?

Control & software4

Software
b6.02[10]
Accurate?
Mini Controller[2]
Accurate?
Software
4.8_26[14]
Accurate?
Software Version
b6.02[10]
Accurate?

Configuration & options33

DxZ[1]
Accurate?
DxL[9]
Accurate?
Refurbished[2]
Accurate?
Silane PECVD[2]
Accurate?
Install Type
Through Wall[2]
Accurate?
All cables present[2]
Accurate?
Bolt Down Lid[2]
Accurate?
Storage Elevator
29 slots[2]
Accurate?
Expanded (21 Slot) VME[2]
Accurate?
Floppy Drive
3 1/2[2]
Accurate?
Remote Frame w/AC Box[2]
Accurate?
Applied Materials Heat Exchanger[2]
Accurate?
No CE Mark[2]
Accurate?
3 CVD (PSG USG)[11]
Accurate?
2 WxZ, 2 WxP[12]
Accurate?
Qty 3 - DLH Delta PECVD Silane
Silane Oxide Deposition[4]
Accurate?
Qty 3 - DLH PECVD Silane
Silane Oxide Deposition[13]
Accurate?
Chamber A
Silane SiO2 PECVD standard 200mm chamber[3]
Accurate?
Chamber B
Silane SiN PECVD standard 200mm chamber[3]
Accurate?
Power
208VAC 50/60Hz[3]
Accurate?
Position A
Silane DCVD[2]
Accurate?
Position B
Silane DCVD[2]
Accurate?
Position C
Silane DCVD[2]
Accurate?
Position D
Empty[2]
Accurate?
Position A
OEM 12 B[2]
Accurate?
Position B
OEM 12 B[2]
Accurate?
Position C
OEM 12 B[2]
Accurate?
Lid Type
Bolddown[2]
Accurate?
Endpoint
Standard[2]
Accurate?
Chamber A
Silane SiO2 PECVD Chamber[3]
Accurate?
Chamber B
Silane SiN PECVD Chamber[3]
Accurate?
OEM
Applied Materials[1]
Accurate?
Model
P 5000 Mark II[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
P 5000 Mark II PECVD, 8" DxZ———Equipment inventory listing[1]
P 5000 Mark II PECVD, 8" DxL———Equipment inventory listing[9]
P 5000 Mark II PECVD, 8"—1991Software: b6.02; 1991 Vintage.Equipment inventory listing[10]
P 5000 Mark II PECVD, 6"—2010Described as refurbished; includes a Wafer Orienter, Phase 3 Robot, Phase 3 Cassette Handler, and other listed hardware/options.Equipment inventory listing[2]
P 5000 Mark II (1991 vintage)—1991Software b6.02, 8 inchEquipment inventory listing[10]
P 5000 Mark II (2010 vintage)—20106 inch, refurbished, Silane PECVD, wafer orienter, Phase 3 robot, Phase 3 cassette handler, bolt down lid, storage elevator 29 slots, expanded 21 slot VME, 3.5 inch floppy drive, mini controller, CES gas panel, RF generator rack, remote frame with AC box, load lock pump Edwards iH 80 Series, Applied Materials heat exchanger, no CE mark, no electrostatic chuck, no independent backside He cool, no VDS, no signal lamp tower, no bolt on SMIF, no standalone endpoint system, chamber positions A/B/C Silane DCVD, position D empty, lid type bolddown, RF match Phase IV, endpoint standard, cathode type susceptor, lid gas distribution GDP, no chamber liner, no autobias, no slit liner door, gas lines: N2 3000 sccm, He 5000 sccm, N2O 3000 sccm, NH3 200 sccm, 2% SiH4/Bal He 5000 sccm, CF4 1600 sccm, N2O 50 sccmEquipment inventory listing[2]
P 5000 Mark II (CVD variant)——8 inch, 208VAC 50/60Hz, dual SATA RAID hard drive, compact flash floppy emulator, flat screen monitors x2, 8 slot storage elevator, Phase III robot, AMAT 0 heat exchanger, remote AC frame with two ENI OEM 12 13.56MHz generators, 12 slot gas panel, chamber A Silane SiO2 PECVD, chamber B Silane SiN PECVDEquipment inventory listing[3]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Gas Panel Type28[2]
  • ConfigurationCES Gas Panel[2]
  • ConfigurationRF Generator Rack[2]
  • Load Lock PumpEdwards iH 80 Series[2]
  • Voltage208VAC 50/60Hz[3]
  • ProcessPlasma-Enhanced Chemical Vapor Deposition (PECVD)[1]
  • Gas LinesN2, He, N2O, NH3, 2% SiH4/Bal He, CF4[2]
  • RF Match TypePhase IV[2]
  • Line 1N2, 3000 sccm, Brooks 5850 / 5964[2]
  • Line 2He, 5000 sccm, Ditto[2]
  • Process typePECVD (Plasma-Enhanced Chemical Vapor Deposition)[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What wafer sizes does the P 5000 Mark II support?

The P 5000 Mark II supports 6-inch and 8-inch wafers.[1][10][2][3]

What RF generators are used?

The system is equipped with 13.56 MHz RF generators, such as the ENI OEM 12 model.[3]

Not publicly documented

The following facts about the P 5000 Mark II are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the P 5000 Mark II are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the P 5000 Mark II are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the P 5000 Mark II are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the P 5000 Mark II is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the P 5000 Mark II are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (14)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Inventory photo
  3. [3]inventory listing
  4. [4]Inventory photo
  5. [5]Inventory photo
  6. [6]Inventory photo
  7. [7]Inventory photo
  8. [8]Inventory photo
  9. [9]inventory listing
  10. [10]inventory listing
  11. [11]inventory listing
  12. [12]inventory listing
  13. [13]inventory listing
  14. [14]inventory listing
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Last updated Oct 10, 2026.

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