Accretech
HRG 200 X
What it is
The Accretech HRG 200 X is a high rigid grinder for semiconductor manufacturing. The HRG 200 X is a fully automatic high rigid two-axis grinder.[4]
How it works
The HRG 200 X has a grinding wheel diameter of 250 mm. The HRG 200 X has a maximum grinding wheel spindle speed of 3600 rmp and a working spindle speed of 800 rpm.[1]
Where it fits in the process flow
General reference — not yet source-verifiedThe HRG 200 X sits in backend wafer processing where grinding and thickness reduction are required. The HRG 200 X is used in a process flow that supports wafer preparation before later singulation or assembly steps.
The HRG 200 X is positioned for precision surface generation rather than circuit formation. The HRG 200 X is used when controlled material removal and a smooth ground surface are required.
What do the numbers mean?
Power & electrical1
Wafer handling2
Configuration & options5
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Motor Power6.3 KW[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What type of grinder is the HRG 200 X?
The HRG 200 X is a fully automatic high rigid two-axis grinder.[4]
Not publicly documented
The following facts about the HRG 200 X are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the HRG 200 X are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the HRG 200 X are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the HRG 200 X are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the HRG 200 X are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the HRG 200 X is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]waferpedia.comwaferpedia.com
- [4]accretech.com — accretech.comaccretech.com
Last updated Oct 10, 2026.
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