A WD 300 T Automatic Dicing

The Accretech A WD 300 T is an automatic dicing saw produced under the Accretech/TSK brand. The A WD 300 T belongs to the Dicing & Grinding category of equipment.^[1][2]

Dicing saws cut with a high-speed rotating blade whose rim contains diamond abrasive. The wafer is held on a vacuum chuck mounted on a precision stage that moves the wafer beneath the blade.

A camera-based alignment system locates alignment marks or circuit patterns on the wafer so that cuts follow the dicing streets. A water spray cools the cutting zone and washes away debris from the kerf.

Dicing is a back-end step in semiconductor manufacturing, performed after wafer fabrication is complete. Wafers are often thinned by grinding and polishing before they reach the dicing saw.

Before dicing, the wafer is mounted on adhesive tape stretched across a frame so that the individual chips remain in place after cutting. The separated chips proceed to cleaning and to later assembly steps such as die attach, wire bonding, and packaging.

Dicing saws singulate silicon wafers into individual die for integrated circuits and discrete semiconductor devices. Compound semiconductor wafers, such as gallium arsenide, are also cut with this class of machine.

Other substrates cut with dicing saws include ceramics, glass, and laminated materials. Finished devices made from diced wafers include memory circuits, logic devices, power semiconductors, light-emitting diodes, micro-electromechanical systems, and sensors.