Karl Suss SB8

Models in this family

1. SB8

   The Karl Suss SB8 Wafer Bonder supports silicon fusion, anodic, and eutectic bonding.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   SB8 Gen2	Gen2	—	Semi-automated universal wafer bonding system capable of handling wafers up to 200 mm; supports fusion, eutectic, diffusion, anodic, anodic triple stack, and adhesive bonding; temperature range 30–500 °C, ramp rate up to 30 K/min; bond force 300 N to 20 kN; footprint 1.2 m x 0.6 m; features Sequential Spacer Removal (SSR) for precise post-bond alignment.	suss.com[1]

Sources