Waferpedia

Tool family

ASM LinDA

ASM LinDA Bonder.

Models in this family

  1. The ASM LinDA is a die bonder used in semiconductor packaging and bonding.

    Cited variants

    DesignationGenerationVintageChangesSource
    CM-LinDA——Variant designation for die bonderdynamicmos.com[1]

Sources

Sources (1)Every fact above is drawn from these public sources
  1. [1]dynamicmos.comdynamicmos.com