Comparison ledger
SUSS MicroTec ACS 200 +, SUSS MicroTec ACS 200 Gen 3, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ACS 200 +SUSS MicroTec | ACS 200 Gen 3SUSS MicroTec |
|---|---|---|
| OEM | SUSS MicroTec | SUSS MicroTec |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | SUSS MicroTec ACS 200 | SUSS MicroTec ACS 200 |
| Cited variants |
|
|
| Specifications | ||
| Voltage | 400 V[1] | — |
| Phase | 3 Phase[1] | — |
| Frequency | 60 Hz[1] | — |
| Configuration | With Gencobot 7S / 3L Transfer Robot[1] | Bake Plate (8):[3] |
| OEM | SUSS MicroTec[1] | — |
| Model | ACS 200 +[1] | — |
| Wafer Sizes | 6 inch[1] | 2, 3, 4, 5, 6, 8, 12 inch[3] |
| Vintage | 2007[1] | 2019 |
| Transfer Robot | Gencobot 7S / 3L[1] | — |
| Developer Module | nDeveloper Module[1] | — |
| Solvent Developer Module | Yes[1] | — |
| Coater Module | Yes[1] | — |
| Thermal Module | 2 hotplates, 1 chillplate[1] | — |
| Controller | Kontron[1] | — |
| Media Storage Tanks | 4[1] | — |
| Media Control Box | SUSS[1] | — |
| Recirculating Chillers | Julabo F30-CL (2), Julabo FC 600 S (2)[1] | — |
| Power Requirements | 400 V, 3 Phase, 60 Hz[1] | — |
| Manufacturer | SUSS[1] | — |
| Equipment type | Coater / Developer[1] | — |
| Developer module type | Solvent developer module[1] | — |
| Coater module | Coater module[1] | — |
| Thermal module | Thermal module with 2 hotplates (1 ea chillplate)[1] | — |
| Set-up Transformer | — | 50 Hz Compatible Model[3] |
| Cassette Stations (4) | — | Compatible with Open Cassettes[3] |
| Wafer Transfer System | — | Dual-Arm (Nidec Sankyo) End Effector[3] |
| Pre-Aligner | — | Equipped with Orientation flat/notch postition rotation for both opague (Si water) & transparent (glass water)substrates[3] |
| Temp | — | 60-250 Deg C[3] |
| Coaters & Developers Vintage | — | 2019 |
| - # of develop line each bowl | — | 2:DEV (binary , fan spray), 2: DI (binary, fan spray), 1:N2 |
| Max Wafer Size (product detail) | — | up to 8 inch[3] |
| Cassette Stations | — | 4 (compatible with Open Cassettes)[3] |
| Bake Plates | — | 8, supports proximity bake, temperature 60-250 °C[3] |
| Cool Plates | — | 3, temperature 18-25 °C, proximity supported[3] |
| Configuration (variant) | — | Coater/Developer with 4 developers, 4D setup[2] |
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