Comparison ledger
Logitech 1 WBS 1 Wafer Substrate, SUSS MicroTec SB 6 E, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1 WBS 1 Wafer SubstrateLogitech | SB 6 ESUSS MicroTec |
|---|---|---|
| OEM | Logitech | SUSS MicroTec |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Logitech 1 WBS 1 Wafer Substrate | SUSS MicroTec SB 6 E |
| Cited variants | — |
|
| Specifications | ||
| Wafer Size | 6 inch[2] | — |
| Wafer size | — | 150 mm o/ to 10 mm x 10 mm[1] |
| Stack thickness | — | up to 6 mm[1] |
| Post-bond alignment accuracy | — | down to 3 μm (down to 1 μm with laser prebond option in BA8/6)[1] |
| Bond force (thermo-compression tool) | — | up to 20 kN[1] |
| Chamber pressure range | — | vacuum to 3 bar (pressurized ambient)[1] |
| Temperature uniformity | — | < 1% at 550°C (on 200 mm wafer)[1] |
| Active cooling | — | Yes[1] |
| Software | — | Windows 2000-based graphical user interface with recipe editor[1] |
| Power requirements | — | 208 – 230 VAC, 50/60 Hz; 20A; 4200W[1] |
| Dimensions (L×D×H) | — | 1200 mm / 625 mm / 1400 mm[1] |
| Weight | — | 340 kg[1] |
| Operating system | — | Windows 2000[1] |
| Network interface | — | TCP/IP Ethernet 10/100 Base T or similar[1] |
| Vacuum requirement | — | 90-95 millibar @ 16.7 slpm, 8 mm OD tubing[1] |
| Compressed air requirement | — | CDA at 6-10 bar @ 16.7 slpm, filtered to < 40 micron, oil-free, 8 mm OD tubing[1] |
| Nitrogen requirement | — | 7-7.5 bar @ 8.4 slpm, filtered to < 40 micron, oil-free, 8 mm OD tubing[1] |
| Exhaust requirement | — | 10.6 cfm @ 0.21 millibar; 2" OD heat resistant connection (to 350°C)[1] |
| Cleanroom recommendation | — | Class 100 or better, 20-22°C, 40-45% RH, vibration isolation floor[1] |
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