Waferpedia

Comparison ledger

SEZ RST 101versus100 ICP Fluorine

Lam Research SEZ RST 101, Oxford Instruments 100 ICP Fluorine, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
SEZ RST 101Lam Research
100 ICP FluorineOxford Instruments
OEMLam ResearchOxford Instruments
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLam Research SEZ RST 101Oxford Instruments 100 ICP Fluorine
Specifications
Process typeWet Etcher[1]—
Wafer size4 inch, 6 inch[1]4 inch, 6 inch, 8 inch (with clamp change)[2]
Etch Gases—SF6, CF4, O2, Ar, N2, CHF3, C4F8[2]
Cryo DRIE etch rate—up to 5 µm/min[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]nanofab.utah.edunanofab.utah.edu