Comparison ledger
Denton Vacuum 635LL, SPTS MVD300, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 635LLDenton Vacuum | MVD300SPTS |
|---|---|---|
| OEM | Denton Vacuum | SPTS |
| Category | Deposition | Deposition |
| Wafer size | 200mm | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Denton Vacuum 635LL | SPTS MVD300 |
| Cited variants | — |
|
| Specifications | ||
| Cathodes | 4-cathodes[2] | — |
| Gas / process feedback | RGA, OES-feedback reactive oxygen or nitrogen sputter[2] | — |
| Chuck temperature | heated/cooled chuck to 500C[2] | — |
| Process mode | co-sputtering[2] | — |
| Substrate size | coats up to 200mm diameter substrates[2] | — |
| Number of cathodes | 4[3] | — |
| Residual gas analysis (RGA) | Included[3] | — |
| Reactive sputtering feedback | OES-feedback reactive oxygen or nitrogen sputter[3] | — |
| Chuck temperature range | Heated/cooled to 500 °C[3] | — |
| Co-sputtering capability | Yes[3] | — |
| Maximum substrate size | 200 mm diameter[3] | — |
| System type | — | Molecular Vapor Deposition (MVD) system[1] |
| Configured models | — | MVD300 / MVD300E[1] |
| Target manufacturing use | — | High volume manufacturing applications[1] |
| Processing mode | — | Batch processing[1] |
| Wafer handling | — | 200mm wafers (Pod loader or EFEM available); 300mm wafers (EFEM enabled)[1] |
| Other substrate formats | — | Singulated die on tape frames; components on trays; custom substrate fixturing available[1] |
| Precursors | — | Up to 4 precursors[1] |
| Integrated functions | — | Integrated plasma surface treatment and chamber clean capability[1] |
| Automation | — | Automated process sequence routines[1] |
| Diagnostics | — | Extensive self-diagnostic and data logging capability[1] |
| Reliability | — | Exceptional reliability[1] |
| Process compatibility | — | MVD and ALD-capable[1] |
| Wafer size | — | 200mm (Pod loader or EFEM) / 300mm (EFEM)[1] |
| Number of precursors | — | Up to 4[1] |
| Plasma treatment | — | Integrated plasma surface treatment and chamber clean capability[1] |
| Substrate types | — | Wafers, singulated die on tape frames, components on trays, custom fixturing[1] |
| ALD capability | — | MVD and ALD-capable[1] |
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