Waferpedia

Comparison ledger

Ecomet 6versus15 Lapper

Buehler Ecomet 6, Lapmaster 15 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Ecomet 6Buehler
15 LapperLapmaster
OEMBuehlerLapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBuehler Ecomet 6Lapmaster 15
Specifications
TypeVariable speed grinder/polisher[1]—
Chuck diameter8 inches[1]—
Max speed340 rpm[1]—
Water requirementRequired[1]—
Electrical115V 60Hz 15A[1]—
Dimensions (L x W x H)30 x 30 x 16 inches[2]—
Weight160 lb[2]—
Number Of Conditioning Rings—Up to 3[3]
Ring ID—Up to 5.5″[3]
Plate Diameter – Outside—15″[3]
Plate Diameter – Inside—3 1/2″[3]
Standard RPM—60[3]
Drive Motor—1/2 HP[3]
Electrics—110V / 1Ph / 60Hz[3]
Dimensions – Approximate—26″(L-R) x 21″(F-B) x 22″(H)[3]
Configuration—Equipped with:[3]
Equipped with: 15″ Cast Iron Plate—Included[3]
Equipped with: (3) Yoke/Roller Bearing Assemblies—Included[3]
Equipped with: (3) Conditioning Rings—Included[3]
Equipped with: (3) Hold Downs—Included[3]
Equipped with: 30 Minute Timer—Included[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]yorkscientific.comyorkscientific.com
  2. [2]hgrinc.comhgrinc.com
  3. [3]inventory listing