Waferpedia

Comparison ledger

101-149-053 Gold BoosterversusConnX Elite

Branson 101-149-053 Gold Booster, Kulicke & Soffa ConnX Elite, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
ConnX EliteKulicke & Soffa
OEMBransonKulicke & Soffa
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBranson 101-149-053 Gold BoosterKulicke & Soffa Connx
Cited variants—
  • ConnX ELITE Opto LA (Large Area)[1]
  • ConnX ELITE Opto ELA (Extended Large Area)[1]
  • ConnX ELITE Opto LA[2]
  • ConnX ELITE Opto ELA[2]
Specifications
Configuration1:1.5[3]50/60 Hz[6]
ManufacturerBranson[4]—
Model101-149-053[4]—
TypeGold Booster[4]high-speed automatic wire bonder[2]
Operating frequency20 kHz[5]—
Gain1:1.5[4]—
Mounting thread1/2-20[5]—
Length5.4 in[5]—
Gain ratio1:1.5[4]—
Bondable area—56 x 80 mm[7]
Placement accuracy—3 µm (3 sigma)[8]
Bonding method—Wire Bonder[8]
Bonding wire length—5 mm[8]
Die pad downset—Up to 2.3 mm[8]
Gold wire size—25.4 µm[8]
Leadframe dimensions—300 x 92 mm[8]
Magazine dimensions—305 x 98 x 178 mm[8]
Minimum loop height—65 µm[8]
Wire pitch—1.27 to 25 mm[8]
Wire sway—25 µm[8]
Air consumption—185 L/min[8]
Air pressure—3.52 kg/sq cm[8]
Power supply—200-240 VAC, -15% to 10%, Single Phase, 50/60 Hz, 2.6 KVA[8]
Net weight—556 kg[8]
Overall dimensions—Base Machine with MHS x 889 x 990 mm[8]
Category—Packaging & Bonding[2]
Power—50/60 Hz[6]

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Sources (8)Every fact above is drawn from these public sources
  1. [1]zaratech.bizzaratech.biz
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com
  5. [5]nextdayautomation.comnextdayautomation.com
  6. [6]inventory listing
  7. [7]kns.comkns.com
  8. [8]semiconductor.directorysemiconductor.directory