Comparison ledger
ASM Eagle 60, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Eagle 60ASM | 1 WBS 1 Wafer SubstrateLogitech |
|---|---|---|
| OEM | ASM | Logitech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | 2002– | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ASM Eagle 60 | Logitech 1 WBS 1 Wafer Substrate |
| Specifications | ||
| Voltage | 240 V[1] | — |
| Configuration | 50/60 Hz[1] | — |
| Phase | 1 Phase[1] | — |
| Frequency | 50/60 Hz[1] | — |
| Minimum bond pitch | 35 micron[2] | — |
| Wire type | Gold[2] | — |
| Productivity improvement | 20% higher than predecessor[2] | — |
| Wire bonding type | Gold wire bonding[2] | — |
| Fine pitch capability | 35 microns[2] | — |
| Wafer Size | — | 6 inch[3] |
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