Comparison ledger
Applied Materials 0010-13622 RF Match for, ASM Eagle XP, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | Eagle XPASM |
|---|---|---|
| OEM | Applied Materials | ASM |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | ASM Eagle |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | XP Platform[2] |
| Model | 0010-13622[1] | Eagle XP[3] |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| Robot Type | — | Yawuski[2] |
| Power Supply & AC Dist Box | — | P/N 1060-625-01[2] |
| Backing Pump(s) | — | ALD/LL/WHC is Edwards IXH 1210[2] |
| Heater Jacket | — | Intraco Taiwan Corporation[3] |
| CDA LLC PN2 | — | 403[2] |
| DIW | — | 2.95[3] |
| Vacuum Load Port Vacuum | — | -86.2[2] |
| Gas LLC Pressure | — | 0.56/0.209 MPA[2] |
| FI | — | 100 Pa[3] |
| Ar | — | 500 SCCM, 3 SLM[3] |
| N2 | — | 500 SCCM[3] |
| Differential | — | 3.5 Pa[3] |
| Process | — | ALD (Atomic Layer Deposition)[3] |
| Wafer size | — | 12 inch[3] |
| Gas delivery | — | Ar 500 SCCM, 3 SLM; N2 500 SCCM[2] |
| HDD | — | not included[3] |
| Cables | — | all cables present[3] |
| System software version | — | 1.58a-001[3] |
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