Comparison ledger
Oxford Instruments 100 ICP Fluorine, SPTS XeF2, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100 ICP FluorineOxford Instruments | XeF2SPTS |
|---|---|---|
| OEM | Oxford Instruments | SPTS |
| Category | Etch | Etch |
| Wafer size | — | Up to 6-inch wafers |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 2013 Acquisition of XACTIX, Inc. · 2013 XACTIX acquisition |
| Control system | — | — |
| Generation | — | — |
| Family | Oxford Instruments 100 ICP Fluorine | SPTS XeF2 |
| Specifications | ||
| Etch Gases | SF6, CF4, O2, Ar, N2, CHF3, C4F8[1] | — |
| Cryo DRIE etch rate | up to 5 µm/min[1] | — |
| Wafer size | 4 inch, 6 inch, 8 inch (with clamp change)[1] | — |
| Etch type | — | Isotropic etch[2] |
| Selectivity | — | Over 1000:1 between Si/photoresist, Si/SiO2, and Si/SiN[2] |
| Gas flow modes | — | Continuous and pulsed gas flow[2] |
| Operating temperature | — | Room temperature[2] |
| Plasma | — | No plasma[2] |
| Substrate size | — | Up to 6-inch wafers[2] |
| Isotropic etch materials | — | Si, Mo, Ge, W, C[2] |
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