Waferpedia

Comparison ledger

Alliance 4400versus100 ICP Fluorine

Lam Research Alliance 4400, Oxford Instruments 100 ICP Fluorine, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Alliance 4400Lam Research
100 ICP FluorineOxford Instruments
OEMLam ResearchOxford Instruments
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones1995 Vintage—
Control system——
Generation——
FamilyLam Research AllianceOxford Instruments 100 ICP Fluorine
Specifications
Configuration2 chamber and Controller[1]—
Configuration (Asset #127688)2 chamber and Controller[1]—
Controller Rack (Asset #127688)Missing[1]—
Configuration (Asset #127686)2 Chamber Set and Controller[2]—
Completeness (Asset #127686)Not a complete set (chamber only)[2]—
Vintage (Asset #127686)1995[2]—
Etch Gases—SF6, CF4, O2, Ar, N2, CHF3, C4F8[3]
Cryo DRIE etch rate—up to 5 µm/min[3]
Wafer size—4 inch, 6 inch, 8 inch (with clamp change)[3]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]nanofab.utah.edunanofab.utah.edu