Comparison ledger
EV Group 101, SUSS MicroTec MA 6 BA 6 Mask, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101EV Group | MA 6 BA 6 MaskSUSS MicroTec |
|---|---|---|
| OEM | EV Group | SUSS MicroTec |
| Category | Lithography | Lithography |
| Wafer size | — | Wafer chuck (1) |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 101 | SUSS MicroTec MA 6 Mask |
| Cited variants | — | |
| Specifications | ||
| OEM | EV Group[4] | — |
| Model | 101[4] | MA 6 / BA 6[3] |
| Equipment name | EVG 101 Spray Coater[4] | — |
| NEMO ID | evgspraycoat[4] | — |
| Training required | EVG 101 Training[4] | — |
| Training duration | 1.50 hours[4] | — |
| Processing technique | Resist Spray Coat (manual)[4] | — |
| Cleanliness | "All"[4] | — |
| Location | SNF Paul G Allen L107 Cleanroom[4] | — |
| Wafer diameter (substrate size) | up to 300 mm[5] | — |
| Available modules | Spin coat / OmniSpray® / develop[5] | — |
| Wafer handling options | Bowed / warped / thin wafer handling, edge handling[5] | — |
| Dispense options | Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[5] | — |
| Processing technique (at SNF) | Resist Spray Coat (manual)[6] | — |
| Cleanliness group (at SNF) | "All"[4] | — |
| Configuration | — | 200-240 V[3] |
| Full Load | — | 10 A[3] |
| Protection | — | 16 A[3] |
| Objectives | — | 5x ,10x , 20x[7] |
| Power | — | 350 W lamphouse[7] |
| Wafer size | — | Wafer chuck (1)[7] |
| System power | — | 230 V, 50/60 Hz[7] |
| Voltage | — | 230 V[2] |
| Make | — | SUSS[3] |
| Alignment | — | TSA (Top-Side Alignment), BSA (Back-Side Alignment)[1] |
| Wafer sizes | — | 2, 3, 4, 5, 6 inch[7] |
| Supports | — | 365 nm and 405 nm exposure wavelengths[7] |
| Lamphouse | — | 350 W[7] |
| Load | — | Single Load[3] |
| Top-Side Alignment (TSA) | — | Supported[7] |
| Back-Side Alignment (BSA) | — | Supported[7] |
| Microscope | — | Suss DVM6 Microscope[7] |
| Optics | — | UV400 optics (supports 365 nm and 405 nm exposure wavelengths)[7] |
| Power supply | — | Gen2 CIC power supply[7] |
| Contact modes | — | Soft, Hard, Vacuum[7] |
| Wafer chuck | — | 1[7] |
| Mask holder | — | 1[7] |
| Vibration-isolation table | — | Included (for MA6)[7] |
| HDD and software | — | Included[7] |
| Voltage range | — | 200-240 V[3] |
| Full load current | — | 10 A[3] |
| Protection current | — | 16 A[3] |
| Power rating (VA) | — | 1500 VA[2] |
| Optical BSA | — | Supported[2] |
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