Comparison ledger
Disco DAG810, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | DAG810Disco | 15Lapmaster |
|---|---|---|
| OEM | Disco | Lapmaster |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | 4" | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DAG810 | Lapmaster 15 |
| Specifications | ||
| Equipment type | compact, automatic grinder[1] | — |
| Materials | silicon, III/V materials (GaN, GaAs, InP), and various glass types (pure amorphous SiO2, float glass, pyrex)[1] | — |
| Wafer sizes supported by universal vacuum chuck table | 4", 5", 6", and 8"[1] | — |
| Mechanical frame use | for UV-tape mounted wafers or chips[1] | — |
| Spindle | high-rigidity, low-vibration spindle[1] | — |
| Grinding wheels | dedicated wheels for coarse and fine silicon grinding, coarse and fine glass grinding, and GaN fine grinding[1] | — |
| Probe-height | real-time probe-height from 4" wafer size[1] | — |
| User interface | LCD touch screen[1] | — |
| Grinding speed | as high as 30 microns/min[1] | — |
| Thickness variation | total thickness variation close to one micron[1] | — |
| Surface roughness | less than 100 nm[1] | — |
| Type | Automatic surface grinder[1] | — |
| Wafer sizes supported | 4", 5", 6", 8"[1] | — |
| Maximum grinding speed | 30 microns/min[1] | — |
| Total thickness variation (TTV) | ~1 micron[1] | — |
| Chuck table | One universal vacuum chuck table for 4", 5", 6", 8" wafer sizes[1] | — |
| Clamping | One mechanical frame clamping for UV-tape mounted wafers or chips[1] | — |
| Cooling method | Water cooling[1] | — |
| Materials processed | Silicon, III/V materials (GaN, GaAs, InP), various glass types (pure amorphous SiO2, float glass, pyrex)[1] | — |
| Workpiece types | Single wafers, stacked wafers, chips[1] | — |
| Wafer size support | 4", 5", 6", 8"[1] | — |
| Spindle type | High-rigidity, low-vibration spindle[1] | — |
| Supported wafer sizes | 4", 5", 6", 8"[1] | — |
| Wheel types | dedicated grinding wheels: coarse and fine silicon, coarse and fine glass, GaN fine[1] | — |
| Thickness reduction phases | 2 or 3 different phases with decreasing feed speed[1] | — |
| Cooling | water cooling to clear particles and mud[1] | — |
| Total thickness variation | close to one micron[1] | — |
| Chucking | one universal vacuum chuck table; one mechanical frame clamping for UV-tape mounted wafers or chips[1] | — |
| Operation interface | LCD touch screen[1] | — |
| Input Power | — | 110 Vac[2] |
| Plate Diameter | — | 15 inches (381 mm)[3] |
| Number of Conditioning Rings | — | 3[3] |
| Ring ID | — | 5.5 inches (140 mm)[3] |
| Standard RPM | — | 60[3] |
| RPM Range (Variable Speed Drive) | — | 0-60[3] |
| Drive Motor - Lapper | — | 0.5 HP (0.37 kW)[3] |
| Drive Motor - Polisher | — | 0.75 HP (0.56 kW)[3] |
| Length | — | 25 inches (635 mm)[3] |
| Width | — | 20 inches (508 mm)[3] |
| Height | — | 24 inches (610 mm)[3] |
| Estimated Shipping Weight | — | 285 lbs (129.3 kg)[3] |
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