Applied Materials
Producer SE alternatives
Comparable Deposition equipment documented in the Waferpedia catalog.
6 comparable tools
Lam Research
Concept One 200
Deposition
Lam / Novellus Concept One 200 is a chemical vapor deposition system.
Lam Research
Concept One 200 PECVD-TEOS
Deposition
The Lam / Novellus Concept One 200 PECVD-TEOS is a plasma-enhanced chemical vapor deposition tool for tetraethyl orthosilicate processing.
Lam Research
Gasonics Vector SOLA
Deposition
The Lam / Novellus / Gasonics Vector SOLA is a plasma-enhanced chemical vapor deposition (PECVD) system that processes 12-inch wafers and includes a UV cure capability.
Orient Service
S 1861 14
Deposition
Orient Service S 1861 14 is a PECVD (plasma-enhanced chemical vapor deposition) system used with SiO2, HCL, HF, NOx, and NH3.
Applied Materials
0010-13622 RF Match for
Deposition
The Applied Materials 0010-13622 is an RF match unit intended for PVD (Physical Vapor Deposition) described as a High Efficiency HE RF Match-Bias.
Applied Materials
0020 12458 Part
Deposition
The Applied Materials 0020 12458 Part is an insulator, side match component for the Hdp-Cvd Ultima Plus system.
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