Comparison ledger
Applied Materials 0010-13622 RF Match for, Temescal VCT-1800, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | VCT-1800Temescal |
|---|---|---|
| OEM | Applied Materials | Temescal |
| Category | Deposition | Deposition |
| Wafer size | — | 7 inches in diameter usable area |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | Temescal VCT-1800 |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | fast cycle load lock, an array of sputtering sources, multi-pocket electron beam gun, and an ion source for etching and ion assisted deposition[2] |
| Model | 0010-13622[1] | — |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| System type | — | thin film deposition system[2] |
| Substrate holder | — | water cooled, RF bias, rotating substrate holder[2] |
| Usable area | — | seven inches in diameter[2] |
| Intended use | — | primarily designed for R&D applications[2] |
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