Takatori

The Takatori MWS 610 SD is a wire saw for dicing applications, introduced in 2017.

The Takatori ATM 1100 E is a film laminator/taping machine that handles 8-inch wafers.

The Takatori ATRM 2100 D is a detaper designed for 6-inch wafers.

The Takatori MWS 610 is a wire saw for dicing and grinding.

The Takatori MWS-SiC6 is a multi wire saw for slicing hard brittle materials.

The Takatori ATRM 2100 Detaper is a wafer detaper also described as an automatic detaper and tape remover.

The Takatori MWS-23N is a multi wire saw model listed in Takatori's Advanced Materials Manufacturing Equipment lineup for slicing hard brittle materials.

Takatori MWS-612SD is a multi wire saw in Takatori's advanced materials manufacturing equipment lineup for slicing hard brittle materials.

The Takatori MWS-SiC12F is a multi wire saw in Takatori's MWS line for slicing hard brittle materials. The Takatori MWS-SiC12F is described as supporting variable processing conditions including thin wire, high wire tension, fast wire running, and extra-long time slicing.

The Takatori MWS-812SD is a multi wire saw for slicing hard brittle materials. The Takatori MWS-812SD is part of Takatori's MWS line for processing quality in slicing and grinding.

Takatori WSD-K2 is a single wire saw developed for outstanding performance comparable to a multi wire saw.

The Takatori MWS-34SN is a multi wire saw for slicing hard brittle materials with variable processing conditions.

The Takatori GLP-150 is a grinder with a high rigidity structure designed for thickness accuracy and adaptability to various grindstones, suitable for automation.

The Takatori MWS-612DN is a multi wire saw for slicing hard brittle materials.

Takatori MWS-44SN is a multi wire saw in Takatori’s advanced materials manufacturing equipment line-up.

The Takatori ATM 8100 S is an automatic wafer mounter for mounting wafers to dicing frames before dicing.

The Takatori MWS 612 is a wire saw in the Dicing & Grinding category. The Takatori MWS 612 has a maximum workpiece shape of φ150mm x 300mm.

The Takatori GLP-200W is a grinder with a high rigidity structure designed for thickness accuracy.

The Takatori MWS 610 SD is a wire cutter.

The Takatori MWS 612 DD Multi is a wire saw for 6-inch wafers.

The Takatori WSD K 3 is a wire saw described as capable of handling SiC, sapphire, quartz crystal and optical materials, and compound semiconductors.

The Takatori MWS-45SN is a multi wire saw in Takatori’s advanced materials manufacturing equipment lineup. The Takatori MWS-45SN is described as a model used for slicing hard brittle materials with variable processing conditions.