Waferpedia

Comparison ledger

58TAversusPB12

YES 58TA, YES PB12, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
58TAYES
PB12YES
OEMYESYES
CategoryThermal / DiffusionThermal / Diffusion
Wafer size300mm300mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyYES 58TAYES PB12
Cited variants—
  • YES-PB8 High Vac Specs[1]
  • YES-PB12 High Vac Specs[1]
Specifications
Operation temperatureambient to 180 °C[2]—
Image reversal bake throughput1 load/hour[2]—
Vacuum bake/vapor prime throughput2 loads/hour[2]—
Wafer handlinghandles wafers up to 300 mm[2]—
Process controlfully programmable process time and temperature[2]—
Series—PB-HV Series (manual load)[1]
Model designation—PB12 High Vac Specs[1]
Wafer size—up to 300mm wafers[1]
Vacuum—high vacuum (10^-5)[1]
Maximum temperature—up to 450°C[1]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]pnf.uchicago.edupnf.uchicago.edu