Waferpedia

Comparison ledger

10100versus242627 B 73 B Semi-Automatic

West Bond 10100, West Bond 242627 B 73 B Semi-Automatic, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10100West Bond
OEMWest BondWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyWest Bond 10100West Bond 242627 B 73 B Semi-Automatic
Specifications
Configuration—Wire feeder[1]
OEM—West Bond[1]
Model—242627 B 73 B[1]
Equipment type—Semi-automatic die bonder[1]
Wire feeder—Included[1]
Heated collet—Included[1]
Monitor—New monitor[1]

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Sources (1)Every fact above is drawn from these public sources
  1. [1]inventory listing