Waferpedia

Comparison ledger

ACS300 Gen3versusAD12

SUSS MicroTec ACS300 Gen3, SUSS MicroTec AD12, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
ACS300 Gen3SUSS MicroTec
AD12SUSS MicroTec
OEMSUSS MicroTecSUSS MicroTec
Category——
Wafer size300mm300mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
GenerationGen3—
FamilySUSS MicroTec ACS300 Gen3SUSS MicroTec AD12
Specifications
System typeAutomated[1]—
Max wafer size300 mm[1]—
Process capabilitiesPriming, Spin Coating, Baking, Aqueous / Solvent Developing[1]—
Operation—Manual[1]
Wafer size—300 mm[1]
Process type—Aqueous[1]
Capabilities—Puddle developing, Spray developing, Wafer cleaning[1]
Sources (1)Every fact above is drawn from these public sources
  1. [1]hilpert.chhilpert.ch