Comparison ledger
Signatone WL-1160, SUSS MicroTec PM5, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | WL-1160Signatone | PM5SUSS MicroTec |
|---|---|---|
| OEM | Signatone | SUSS MicroTec |
| Category | Test & Probe | Test & Probe |
| Wafer size | 150mm | 150mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Signatone WL-1160 | SUSS MicroTec PM5 |
| Specifications | ||
| Product type | RF / Microwave Probe Station[1] | — |
| Application focus | high-frequency, high-power, and millimeter wave applications[1] | — |
| Operating characteristic | non-resonant operation is critical[1] | — |
| Chuck sizes | 150mm and 200mm chucks[1] | — |
| Calibration chuck | Independent calibration chuck located adjacent to the main chuck[1] | — |
| Calibration chuck material | Non-resonant polymer[1] | — |
| Microscope stage | 2" x 2" microscope stage[1] | — |
| Microscope compatibility | Supports most StereoZoom and high-powered microscopes[1] | — |
| Platform sharing | Uses the same stable platform as the S-1160 multipurpose probe station[1] | — |
| X-Y motion control | 150mm & 200mm manual X-Y motion control[1] | — |
| Microscope stage control | 50mm X 50mm microscope stage control[1] | — |
| Height control | Separate contact / separate and platen height control[1] | — |
| Z motion | Up to 30mm Z motion control of platen[1] | — |
| Micropositioner capacity | Holds up to four S-96MW microwave micropositioners[1] | — |
| Standard manifolds | Vacuum and DC manifolds standard[1] | — |
| system type | — | analytical probe system[2] |
| wafer/substrate diameter | — | up to 150 mm (6″)[2] |
| measurement modes | — | DC and HF measurements[2] |
| failure analysis use | — | suitable as a failure analysis tool[2] |
| probe heads | — | up to 12 SUSS probe heads at one time[2] |
| manipulator probe function | — | nanowires may be picked and placed onto a device or substrate[2] |
| Measurement types | — | DC and HF[2] |
| Max probe heads | — | up to 12 SUSS probe heads[2] |
| Manipulator probe | — | for nanowire pick-and-place[2] |
| Wafer/substrate diameter | — | up to 150 mm (6 in)[2] |
| Failure analysis | — | suitable as a failure analysis tool[2] |
| Contact points | — | up to 4 contact points can be operated independently at the same time[3] |
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