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Comparison ledger

6532HPversus10490

Palomar 6532HP, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
6532HPPalomar
10490West Bond
OEMPalomarWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyPalomar 6532HPWest Bond 10490
Specifications
Machine typeDie bonder[1]—
Performance descriptionHigh performance[1]—
Target marketPhotonics market[1]—
Presentation stationHigh volume[1]—
Bonding stationHigh precision[1]—
Component transferHigh-speed die shuttle[1]—
ProcessesSilver Sintering Die Bonding; Eutectic Die Bonding; Epoxy Die Bonding; UV Die Bonding; Solder Paste Die Bonding[1]—
CategoryPalomar Die Bonders[1]—
Application focusPhotonics market[1]—
Station architectureHigh volume presentation station with a high precision bonding station[1]—
Transfer mechanismHigh speed die shuttle[1]—
VisionVisionPilot® with Vision Standardization[1]—
Data systemBond Data Miner[1]—
Heating optionPulsed Heat Systems[1]—
Dispensing optionDispensing Solutions[1]—
Automation optionAutomated Handler System[1]—
UV optionUV Systems[1]—
Identification optionIdentification Systems[1]—
Manufacturer—West Bond[2]
Model—10490[2]
Description—Convertible bonder, wedge to ball[3]
Tool type—Convertible bonder[4]
Bonding modes—Wedge bonding and ball bonding[4]
Use—Wire bonding[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]Equipment inventory listing
  3. [3]fabsurplus.comfabsurplus.com
  4. [4]waferpedia.comwaferpedia.com